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Adhesion Applications

Solutions for structural adhesives, glue for fixation and assembly, adhesives for microelectronics.

STRUCTURAL ADHESIVES

More and more frequently, we find that the fixation of mechanical and structural elements using adhesives has been replacing traditional welding, riveting, clipping, etc., for various reasons:

  • The Miniaturization of the elements to be joined minimizes the available space.
  • Protection: Adhesive-applied elements are isolated and protected from oxidation and external aggressions.
  • Use of advanced materials, thinner and more delicate, with specific alloys that only allow adhesives.
  • Specific characteristics where additional requirements such as electrical insulation, thermal conductivity, etc., are needed.

APS collaborates to find cost-effective solutions in adhesion processes, covering all phases and aspects of the project:

Analysis and definition of surface treatments, areas, surfaces, and geometries to be joined, types of stresses, specific requirements. Selection of adhesive, samples, testing, handling, storage, dispensing, and curing.

We offer a wide range of products to meet any need:

  • Acrylic, epoxy, and polyurethane adhesives in one- and two-component formulations.
  • Light-curing single-component adhesives, technical hot-melts.
  • Anaerobic adhesives, silicone adhesives curable by heat or moisture.
  • Dual-curing adhesives (light/heat, light/moisture, light/anaerobic, etc.).
  • Surface cleaning, activation, priming products, etc.

We serve a wide range of industrial sectors: plastic engineering, metal-mechanics, optics, electronics and microelectronics, solar (PV, HCPV, TF), sensors, LED lighting, etc.

ADHESIVES FOR FIXATION AND ASSEMBLY

It is often convenient and necessary to secure delicate and/or large electronic components mounted on electronic boards: electrolytic capacitors, Reed relays, coils and toroids, transformers, connectors, etc.

This aspect becomes especially important under mechanically demanding working conditions:

  • Significant and/or continuous vibrations over time.
  • Impacts at different acceleration levels.
  • Weak or insufficient natural welds or fixations to support the component's weight.
  • Combinations of these factors.

We offer innovative solutions with semi-rigid products that provide strong mechanical fixation without inducing mechanical stress on these components, ensuring effective fixation and durability of assemblies.

We have extensive experience in industrial applications such as filtration and vibration equipment, construction machinery, automotive, railway, etc., defining suitable solutions for any situation or production process.

ADHESIVES FOR MICROELECTRONICS

APS offers a wide range of products for microelectronics applications, where specially formulated materials are required to meet critical requirements:

  • High purity and virtually no ionic content.
  • Very specific expansion coefficients and Tg.
  • Excellent adhesion to metals, ceramics, plastics, FR4, etc.
  • Adaptability to high-precision and/or high-speed processes.

We are experts in multiple specific microelectronics applications:

  • Dam & Fill (rigid or flexible).
  • Glob-Top.
  • Chip encapsulation.
  • Die-Attach.
  • Fixation of SMD components.
  • Sealing and fixation of BGAs.
  • Flow & No-Flow underfillers.

We cover all aspects of requirements analysis, adhesive selection, handling, dispensing, and curing for highly demanding sectors such as military, aerospace, aeronautics, sensor technology, RFID - Smart Labels, etc.

We collaborate with proven dispensing specialists: Asymtech, Mühlbauer, Dima, Camalot, etc.